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Patent Searching and Data


Title:
PLATING LIQUID
Document Type and Number:
WIPO Patent Application WO/2018/180192
Kind Code:
A1
Abstract:
This plating liquid contains (A) a soluble salt that contains at least a first tin salt, (B) an acid selected from among organic acids and inorganic acids or a salt thereof, and (C) two surfactants, namely an amine-based surfactant (C1) and a nonionic surfactant (C2 and/or C3). The amine-based surfactant (C1) is a polyoxyethylene alkyl amine represented by general formula (1); and the nonionic surfactant (C2 and/or C3) is a condensation product of a polyoxyethylene and a polyoxypropylene represented by general formula (2) or general formula (3). In formula (1), x is 12-18 and y is 4-12. In formula (2), m is 15-30 and (n1 + n2) is 40-50. In formula (3), (m1 + m2) is 15-30 and n is 40-50.

Inventors:
WATANABE MAMI (JP)
NAKAYA KIYOTAKA (JP)
KONNO YASUSHI (JP)
Application Number:
PCT/JP2018/007997
Publication Date:
October 04, 2018
Filing Date:
March 02, 2018
Export Citation:
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Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C25D3/30
Foreign References:
JP2003342778A2003-12-03
JPH10306396A1998-11-17
JPS5864393A1983-04-16
JPS61117298A1986-06-04
JP2007332447A2007-12-27
JP2011063834A2011-03-31
JPS63161188A1988-07-04
JPS61175A1986-01-06
JP2017061175A2017-03-30
JP2018031865A2018-03-01
JP2005290505A2005-10-20
JP2013044001A2013-03-04
JP2012087393A2012-05-10
Other References:
See also references of EP 3604622A4
Attorney, Agent or Firm:
SUDA, Masayoshi (JP)
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