Title:
PLATING SOLUTIONS FOR ELECTROLESS DEPOSITION OF RUTHENIUM
Document Type and Number:
WIPO Patent Application WO/2010/056612
Kind Code:
A3
Abstract:
An electroless ruthenium plating solution is disclosed herein. The solution includes a ruthenium source, a polyamino polycarboxylic acid complexing agent, a reducing agent, a stabilizing agent, and a pH-modifying substance. A method of preparing an electroless ruthenium plating solution is also provided.
Inventors:
ZIELIENE ALBINA (LT)
VASKELIS ALGIRDAS (LT)
NORKUS EUGENIJUS (LT)
VASKELIS ALGIRDAS (LT)
NORKUS EUGENIJUS (LT)
Application Number:
PCT/US2009/063631
Publication Date:
July 29, 2010
Filing Date:
November 06, 2009
Export Citation:
Assignee:
LAM RES CORP (US)
ZIELIENE ALBINA (LT)
VASKELIS ALGIRDAS (LT)
NORKUS EUGENIJUS (LT)
ZIELIENE ALBINA (LT)
VASKELIS ALGIRDAS (LT)
NORKUS EUGENIJUS (LT)
International Classes:
C23C18/54
Foreign References:
| US5203911A | 1993-04-20 | |||
| US20060278123A1 | 2006-12-14 | |||
| US20050013928A1 | 2005-01-20 | |||
| US20050142685A1 | 2005-06-30 |
Attorney, Agent or Firm:
GENCARELLA, Michael, L. (Llp710 Lakeway Drive, Suite 20, Sunnyvale CA, US)
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