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Title:
PLATINUM THIN FILM AND THERMAL SENSOR
Document Type and Number:
WIPO Patent Application WO/2003/102974
Kind Code:
A1
Abstract:
A platinum thin film having a silicon substrate (1) in a flat plate form and, formed thereon in the following order, an insulating film (3) and a platinum thin film (6), wherein the insulating film (3) comprises an oxide or nitride whose intermetallic compound with platinum has no eutectic point between platinum at a temperature of 850&ring C or lower and thus has a TCR of 3500 ppm&sol &ring C or more. A thermal sensor, wherein a heat−sensitive resistor (6) and a temperature detecting portion are formed by using the above platinum thin film as a heat−sensitive resisting film, and the silicon substrate (1) in a flat plate form is partly removed under the region in which the heat−sensitive resistor is formed, to thereby form a diaphram portion (12). The thermal sensor exhibits improved sensitivity.

Inventors:
TSUTSUMI KAZUHIKO (JP)
OHJI HIROSHI (JP)
YAMASHITA AKIRA (JP)
Application Number:
PCT/JP2002/005426
Publication Date:
December 11, 2003
Filing Date:
June 03, 2002
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP (JP)
TSUTSUMI KAZUHIKO (JP)
OHJI HIROSHI (JP)
YAMASHITA AKIRA (JP)
International Classes:
G01F1/684; G01F1/692; G01K7/18; (IPC1-7): H01C7/02; G01F1/68; G01P5/12
Foreign References:
JPH11326072A1999-11-26
JPH042967A1992-01-07
Attorney, Agent or Firm:
Miyata, Kaneo c/o Mitsubishi Denki Kabushiki Kaisha (2-3 Marunouchi 2-Chom, Chiyoda-ku Tokyo, JP)
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