POINT ETCHING MODULE USING ANNULAR SURFACE-DISCHARGE PLASMA APPARATUS AND METHOD FOR CONTROLLING ETCH PROFILE OF POINT ETCHING MODULE

Title:

POINT ETCHING MODULE USING ANNULAR SURFACE-DISCHARGE PLASMA APPARATUS AND METHOD FOR CONTROLLING ETCH PROFILE OF POINT ETCHING MODULE

Document Type and Number:

WIPO Patent Application WO/2019/160329

Kind Code:

A1

Abstract:

A point etching module using an annular surface-discharge plasma apparatus is disclosed. The point etching module using an annular surface-discharge plasma apparatus comprises: a plate-shaped dielectric; a circular electrode disposed on and in contact with the upper surface of the dielectric; an annular electrode disposed on and in contact with the lower surface of the dielectric and providing a gas receiving space for receiving gas; and a power supplier for applying high voltage between the circular electrode and the annular electrode, wherein when the application of the high voltage starts an electric discharge, filament type plasma is irradiated toward a substrate to be treated, by using plasma flowing in the center direction of the annular electrode from between the inner surface of the annular electrode and the lower surface of the dielectric.

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Inventors:

SEOK DONG CHAN (KR)
LHO TAI HYEOP (KR)
JUNG YONG HO (KR)
CHOI YONG SUP (KR)
LEE KANG IL (KR)
YOO SEUNG RYUL (KR)
JANG SOO OUK (KR)

Application Number:

PCT/KR2019/001765

Publication Date:

August 22, 2019

Filing Date:

February 13, 2019

Export Citation:

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Assignee:

KOREA BASIC SCIENCE INST (KR)

International Classes:

H01L21/67; H01J37/32; H01L21/3065; H05H1/46

Foreign References:

JP2014112644A	2014-06-19
KR20140084018A	2014-07-04
JPH1172606A	1999-03-16
KR20160136551A	2016-11-30
JP2007149559A	2007-06-14

Other References: