Title:
POLISHER
Document Type and Number:
WIPO Patent Application WO/2002/034467
Kind Code:
A1
Abstract:
The invention relates to a polisher for polishing a workpiece, such as a semiconductor wafer, so that it may have a flat mirror finish. The polisher comprises a polisher table (1) with a polishing face, and a top ring (3). A workpiece is placed between the polisher table (1) and the top ring (3) and polished by application of a predetermined pressure. The polisher includes at least two dressing units equipped with dressers (7, 11) that are in contact with the surface of polishing cloth to dress the polishing face.
Inventors:
KAMIMURA KENJI (JP)
KIMURA NORIO (JP)
OKAMURA SATOSHI (JP)
AIZAWA HIDEO (JP)
AKAGI MAKOTO (JP)
TOKUSHIGE KATSUHIKO (JP)
MATSUO HISANORI (JP)
TSUJIMURA MANABU (JP)
KIMURA NORIO (JP)
OKAMURA SATOSHI (JP)
AIZAWA HIDEO (JP)
AKAGI MAKOTO (JP)
TOKUSHIGE KATSUHIKO (JP)
MATSUO HISANORI (JP)
TSUJIMURA MANABU (JP)
Application Number:
PCT/JP2001/000382
Publication Date:
May 02, 2002
Filing Date:
January 22, 2001
Export Citation:
Assignee:
EBARA CORP (JP)
KAMIMURA KENJI (JP)
KIMURA NORIO (JP)
OKAMURA SATOSHI (JP)
AIZAWA HIDEO (JP)
AKAGI MAKOTO (JP)
TOKUSHIGE KATSUHIKO (JP)
MATSUO HISANORI (JP)
TSUJIMURA MANABU (JP)
KAMIMURA KENJI (JP)
KIMURA NORIO (JP)
OKAMURA SATOSHI (JP)
AIZAWA HIDEO (JP)
AKAGI MAKOTO (JP)
TOKUSHIGE KATSUHIKO (JP)
MATSUO HISANORI (JP)
TSUJIMURA MANABU (JP)
International Classes:
B24B53/00; B24B53/007; B24B53/017; H01L21/306; (IPC1-7): B24B37/00; B24B53/02; H01L21/304
Domestic Patent References:
| WO1999050024A1 | 1999-10-07 |
Foreign References:
| US5990010A | 1999-11-23 | |||
| JP2001038602A | 2001-02-13 | |||
| JPH10180618A | 1998-07-07 | |||
| JP2000271854A | 2000-10-03 | |||
| JPH10202504A | 1998-08-04 | |||
| JPH09277157A | 1997-10-28 |
Other References:
See also references of EP 1334802A4
Attorney, Agent or Firm:
Watanabe, Isamu (Tokyo, JP)
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