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Title:
POLISHING AGENT AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/203680
Kind Code:
A1
Abstract:
Provided is a polishing agent for polishing a polishing target surface including indium tin oxide, said polishing agent comprising: polishing grains; at least one dicarboxylic acid component selected from the group consisting of dicarboxylic acids with 3 or fewer carbon atoms and salts thereof; and water, wherein the polishing grains include silica and have a positive zeta potential, and pH is not more than 9.0.

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Inventors:
HANANO MASAYUKI (JP)
KAWAKITA JUNPEI (JP)
HAGA KOUJI (JP)
Application Number:
PCT/JP2022/018286
Publication Date:
October 26, 2023
Filing Date:
April 20, 2022
Export Citation:
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Assignee:
RESONAC CORP (JP)
International Classes:
C09K3/14; B24B37/00; H01L21/304
Foreign References:
JP2007154176A2007-06-21
KR20200062732A2020-06-04
JP2020045480A2020-03-26
KR20200032602A2020-03-26
US20210130651A12021-05-06
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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