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Title:
POLISHING COMPOSITION, POLISHING METHOD IN WHICH SAME IS USED, AND METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2018/055985
Kind Code:
A1
Abstract:
[Problem] To provide a polishing composition with which it is possible to effectively improve the polishing rate of an object to be polished. [Solution] A polishing composition containing abrasive grains, a polishing accelerator having a nucleophilic parameter represented by formula (1) of 14.5-30, and water.

Inventors:
SUZUKI SHOTA (JP)
Application Number:
PCT/JP2017/030786
Publication Date:
March 29, 2018
Filing Date:
August 28, 2017
Export Citation:
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Assignee:
FUJIMI INC (JP)
International Classes:
C09K3/14; B24B37/00; C09G1/02; H01L21/304
Domestic Patent References:
WO2009096495A12009-08-06
WO2012005289A12012-01-12
WO2009025383A12009-02-26
WO2012141145A12012-10-18
Foreign References:
JP2003507895A2003-02-25
JP2002030276A2002-01-31
JPS52112192A1977-09-20
JP2008147651A2008-06-26
JP2006156825A2006-06-15
JPH09137155A1997-05-27
Attorney, Agent or Firm:
HATTA & ASSOCIATES (JP)
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