Title:
POLISHING COMPOSITION, METHOD FOR MANUFACTURING SAME, AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2016/051636
Kind Code:
A1
Abstract:
Provided is a polishing composition whereby a polishing object such as simple silicon, a silicon compound, or a metal, particularly a polishing object including tungsten, can be polished at a high polishing speed. The polishing composition contains colloidal silica in which an organic acid is immobilized on the surface thereof, hydrogen peroxide, and a salt. The salt is ammonium nitrate and/or ammonium sulfate.
Inventors:
SATO TAKEKI (JP)
SAKABE KOICHI (JP)
SAKABE KOICHI (JP)
Application Number:
PCT/JP2015/003754
Publication Date:
April 07, 2016
Filing Date:
July 27, 2015
Export Citation:
Assignee:
FUJIMI INC (JP)
International Classes:
C09K3/14; B24B37/00; C09G1/02; H01L21/304
Domestic Patent References:
| WO1998054756A1 | 1998-12-03 |
Foreign References:
| JP2013138053A | 2013-07-11 | |||
| US20050258139A1 | 2005-11-24 | |||
| JPH06313164A | 1994-11-08 |
Attorney, Agent or Firm:
MORI, Tetsuya et al. (JP)
Woods Tetsuya (JP)
Woods Tetsuya (JP)
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