Title:
POLISHING COMPOSITION AND METHOD FOR PRODUCING POLISHING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2016/031485
Kind Code:
A1
Abstract:
The present invention provides a polishing composition with which it is possible to adequately control the polishing rate with respect to a material having a low relative dielectric constant. The present invention is a polishing composition which contains abrasive grains and an organic compound, wherein the organic compound has a polyoxyalkylene group and an aliphatic hydrocarbon group having three or more carbon atoms. The polishing composition is used to polish a substance having a relative dielectric constant of 4 or lower.
Inventors:
YASUI AKIHITO (JP)
Application Number:
PCT/JP2015/071714
Publication Date:
March 03, 2016
Filing Date:
July 30, 2015
Export Citation:
Assignee:
FUJIMI INC (JP)
International Classes:
C09K3/14; B24B37/00; C09G1/02; H01L21/304
Foreign References:
| JP2005529485A | 2005-09-29 | |||
| JP2014060205A | 2014-04-03 | |||
| JP2014027297A | 2014-02-06 | |||
| JP2014069260A | 2014-04-21 |
Attorney, Agent or Firm:
HATTA & ASSOCIATES (JP)
Hatta international patent business corporation (JP)
Hatta international patent business corporation (JP)
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