Title:
POLISHING COMPOSITION AND POLISHING METHOD USING SAME
Document Type and Number:
WIPO Patent Application WO/2023/189701
Kind Code:
A1
Abstract:
The present invention relates to a polishing composition including abrasive grains and a dispersion medium, wherein the pH is less than 5.0, the abrasive grains comprise surface-modified silica particles having an organic acid immobilized on surfaces thereof, the surface coverage of silanol groups present on the surfaces of the surface-modified silica particles is more than 0% but not more than 6.0%, and the average primary particle diameter of the abrasive grains is 20-100 nm inclusive. According to the present invention, the polishing speed of a silicon oxide film is improved, and a means for polishing a silicon oxide film and a silicon nitride film at approximately the same speed is provided.
Inventors:
SUZUKI SHOTA (JP)
HIRANO TATSUHIKO (JP)
TSUBOTA SHOGO (JP)
ASHITAKA KEIJI (JP)
ITO MASAAKI (JP)
HIRANO TATSUHIKO (JP)
TSUBOTA SHOGO (JP)
ASHITAKA KEIJI (JP)
ITO MASAAKI (JP)
Application Number:
PCT/JP2023/010520
Publication Date:
October 05, 2023
Filing Date:
March 17, 2023
Export Citation:
Assignee:
FUJIMI INC (JP)
International Classes:
H01L21/304; B24B37/00; C01B33/18; C09K3/14
Domestic Patent References:
| WO2018012174A1 | 2018-01-18 |
Foreign References:
| JP2016149402A | 2016-08-18 | |||
| JP2015067752A | 2015-04-13 | |||
| JP2020053519A | 2020-04-02 | |||
| JP2013021292A | 2013-01-31 | |||
| JP2017123467A | 2017-07-13 |
Attorney, Agent or Firm:
IBC (JP)
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