Title:
POLISHING COMPOSITION FOR SEMICONDUCTOR PROCESSING, METHOD FOR PREPARING POLISHING COMPOSITION, AND METHOD FOR MANUFACTURING SEMICONDUCTOR ELEMENT TO WHICH POLISHING COMPOSITION IS APPLIED
Document Type and Number:
WIPO Patent Application WO/2022/145654
Kind Code:
A1
Abstract:
The present invention relates to a polishing composition for semiconductor processing, a method for manufacturing the polishing composition, and a method for manufacturing a semiconductor device to which the polishing composition is applied and, specifically, to a polishing composition applied to the polishing process of an amorphous carbon layer (ACL) film, and may provide a polishing composition that can exhibit a high polishing rate for an amorphous carbon film, has no problem of reduction in the polishing rate at 45° C or higher, has increased long-term storage stability, can prevent carbon residues generated during the polishing process from being adsorbed on a semiconductor substrate, and can prevent a polishing pad from being contaminated. In addition, a method for manufacturing a semiconductor device to which the polishing composition for semiconductor processing is applied may be provided.
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Inventors:
PARK HAN TEO (KR)
HAN DEOK SU (KR)
KWON JANG KUK (KR)
HONG SEUNG CHUL (KR)
HAN DEOK SU (KR)
KWON JANG KUK (KR)
HONG SEUNG CHUL (KR)
Application Number:
PCT/KR2021/014487
Publication Date:
July 07, 2022
Filing Date:
October 18, 2021
Export Citation:
Assignee:
SKC SOLMICS CO LTD (KR)
International Classes:
C09G1/02; C09K3/14; H01L21/02; H01L21/3105
Foreign References:
| KR20070098082A | 2007-10-05 | |||
| KR20160054466A | 2016-05-16 | |||
| US20160314989A1 | 2016-10-27 | |||
| JP2020105345A | 2020-07-09 | |||
| KR20190132951A | 2019-11-29 |
Attorney, Agent or Firm:
WON, Dae Gyu (KR)
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