POLISHING COMPOSITION

Title:

POLISHING COMPOSITION

Document Type and Number:

WIPO Patent Application WO/2013/069623

Kind Code:

A1

Abstract:

Provided is a polishing composition containing at least water and silica and satisfying all of the following conditions a) through d). a) The specific surface area of the silica contained in the polishing composition is not less than 30 m2/g. b) Silica having a grain size of 10-50 nm inclusive is included, in the amount of 2 mass% or more. c) Silica having a grain size of 60-300 nm inclusive is included, in the amount of 2 mass% or more. d) The value found by dividing the mean grain size of the silica described in c) by the mean grain size of the silica described in b) is not less than 2. If this polishing composition is used, a brittle material substrate can be polished at high speed, and such polishing speed can be maintained for a long period of time even if this polishing composition is used repeatedly.

Inventors:

MORINAGA HITOSHI (JP)
ASANO HIROSHI (JP)
SERIKAWA MASAYUKI (JP)

Application Number:

PCT/JP2012/078696

Publication Date:

May 16, 2013

Filing Date:

November 06, 2012

Export Citation:

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Assignee:

FUJIMI INC (JP)

International Classes:

B24B37/00; C09K3/14; H01L21/304

Domestic Patent References:

WO2008105342A1

2008-09-04

Foreign References:

JP2008124221A	2008-05-29
JP2009279720A	2009-12-03
JP2007145633A	2007-06-14
JP2008044078A	2008-02-28
JP2003529662A	2003-10-07

Other References: