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Patent Searching and Data


Title:
POLISHING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2016/072371
Kind Code:
A1
Abstract:
Provided is a polishing composition for polishing materials to be polished having a Vickers hardness of 1,500 Hv or higher. With this polishing composition, the relationship between the oxidation-reduction potential ORPx [mV] of the polishing composition and the oxidation-reduction potential ORPy [mV] of the material to be polished satisfy the following equation: ORPx - ORPy ≥ 100 mV.

Inventors:
TAKAHASHI SHUHEI (JP)
TOMATSU MASATOSHI (JP)
Application Number:
PCT/JP2015/080844
Publication Date:
May 12, 2016
Filing Date:
October 30, 2015
Export Citation:
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Assignee:
FUJIMI INC (JP)
International Classes:
C09K3/14; B24B37/00; H01L21/304
Domestic Patent References:
WO2013150822A12013-10-10
WO2011070898A12011-06-16
WO2012147605A12012-11-01
WO2015059987A12015-04-30
Foreign References:
JP2008068390A2008-03-27
JP2007311586A2007-11-29
JP2011513991A2011-04-28
JP2007021703A2007-02-01
Other References:
See also references of EP 3216839A4
Attorney, Agent or Firm:
ABE MAKOTO (JP)
Makoto Abe (JP)
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