Title:
POLISHING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2017/169808
Kind Code:
A1
Abstract:
[Problem] The purpose of the present invention is to provide a technique which, when polishing an object to be polished that contains (a) a material having a silicon-nitrogen bond and (b) another material, can improve the ratio of the polishing speed of the material (a) relative to the polishing speed of the material (b). [Solution] A polishing composition which is used to polish an object to be polished that contains (a) a material having a silicon-nitrogen bond and (b) another material, the polishing composition containing: silica on which an organic acid is immobilized; and a specific selectivity-improving agent that can improve the ratio of the polishing speed of the material (a) relative to the polishing speed of the material (b).
Inventors:
YOSHIZAKI YUKINOBU (JP)
SAKABE KOICHI (JP)
KADOHASHI YUSUKE (JP)
SAKABE KOICHI (JP)
KADOHASHI YUSUKE (JP)
Application Number:
PCT/JP2017/010521
Publication Date:
October 05, 2017
Filing Date:
March 15, 2017
Export Citation:
Assignee:
FUJIMI INC (JP)
International Classes:
B24B37/00; C09K3/14; H01L21/304
Domestic Patent References:
| WO2014119301A1 | 2014-08-07 |
Foreign References:
| JP2015096619A | 2015-05-21 | |||
| JP2015201644A | 2015-11-12 | |||
| JP2015174953A | 2015-10-05 | |||
| JPH0820765A | 1996-01-23 | |||
| JP2000265159A | 2000-09-26 | |||
| JP2004079984A | 2004-03-11 | |||
| JP2002313760A | 2002-10-25 | |||
| JP2005179421A | 2005-07-07 |
Attorney, Agent or Firm:
HATTA & ASSOCIATES (JP)
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