Title:
POLISHING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2018/131341
Kind Code:
A1
Abstract:
A polishing composition including abrasive grains, a dispersion medium, and an additive, the polishing composition being for use in polishing an object to be polished, wherein the abrasive grains are surface modified, the additive is represented by formula 1 (in formula 1, X1 is O or NR4, X2 is a single bond or NR5, and R1-R5 each independently are: a hydrogen atom; a hydroxyl group; a nitro group; a nitroso group; a C1-4 alkyl group optionally substituted by a carboxyl group, an amino group, or a hydroxyl group; or CONH2; where: R2 and R5 may form a ring; when X2 is a single bond, R3 is not a hydrogen atom or R1-R3 are not methyl groups; and when X2 is NR5 and three among R1-R3 and R5 are hydrogen atoms, the fourth is a hydrogen atom or a methyl group), and the pH of the polishing composition is 5.0 or lower. The present invention provides a polishing composition with which it is possible to polish not only polycrystalline silicon but also a silicon nitride film at high speeds and to reduce the polishing speed for polishing a silicon oxide film.
Inventors:
YARITA SATORU (JP)
YOSHIZAKI YUKINOBU (JP)
YOSHIZAKI YUKINOBU (JP)
Application Number:
PCT/JP2017/044018
Publication Date:
July 19, 2018
Filing Date:
December 07, 2017
Export Citation:
Assignee:
FUJIMI INC (JP)
International Classes:
C09K3/14; B24B37/00; H01L21/304
Domestic Patent References:
| WO2008013226A1 | 2008-01-31 | |||
| WO2009096495A1 | 2009-08-06 |
Foreign References:
| JP2008546214A | 2008-12-18 | |||
| JP2015193714A | 2015-11-05 | |||
| JP2016069465A | 2016-05-09 | |||
| JP2001207170A | 2001-07-31 |
Attorney, Agent or Firm:
HATTA & ASSOCIATES (JP)
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