Title:
POLISHING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2020/137278
Kind Code:
A1
Abstract:
Provided is a polishing composition with which micro defects and haze in a polished semiconductor wafer can be further reduced. This polishing composition comprises abrasive grains, a basic compound, a vinyl alcohol-based resin having 1,2-diol structural unit represented by general formula (A), and a vinyl alcohol-based resin having a polyoxyethylene structural unit represented by general formula (B), where: R1, R2 and R3 are each independently a hydrogen atom or an organic group; X is a single bond or a bonded chain; R4, R5 and R6 are each independently a hydrogen atom or an organic group; and m is an integer of 1 to 1,000.
Inventors:
SUGITA NORIAKI (JP)
MATSUSHITA TAKAYUKI (JP)
MATSUSHITA TAKAYUKI (JP)
Application Number:
PCT/JP2019/045657
Publication Date:
July 02, 2020
Filing Date:
November 21, 2019
Export Citation:
Assignee:
NITTA DUPONT INCORPORATED (JP)
International Classes:
C09K3/14; B24B37/00; H01L21/304
Domestic Patent References:
| WO2017069253A1 | 2017-04-27 |
Foreign References:
| JP2012216723A | 2012-11-08 | |||
| JP2015084379A | 2015-04-30 | |||
| JP2016056220A | 2016-04-21 | |||
| JP2016213216A | 2016-12-15 | |||
| JPH11140427A | 1999-05-25 |
Attorney, Agent or Firm:
UEBA Hidetoshi et al. (JP)
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