Title:
POLISHING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2024/024413
Kind Code:
A1
Abstract:
The present invention provides means for preventing sedimentation of abrasive grains and improving redispersibility of abrasive grains, while improving polishing performance. The present invention relates to a polishing composition comprising abrasive grains, an oxidant, a metal cation exhibiting a hydrated metal ion pKa of less than 7.0, a metal salt A which is a salt with an anion, a layered compound, and a dispersant, the polishing composition including the metal salt A at a concentration of 8 mM or more.
Inventors:
NAKAGAI YUICHIRO (JP)
Application Number:
PCT/JP2023/024731
Publication Date:
February 01, 2024
Filing Date:
July 04, 2023
Export Citation:
Assignee:
FUJIMI INC (JP)
International Classes:
H01L21/304; B24B37/00; C09G1/02; C09K3/14
Domestic Patent References:
| WO2018123875A1 | 2018-07-05 | |||
| WO2017187749A1 | 2017-11-02 |
Foreign References:
| JP2000510176A | 2000-08-08 | |||
| KR101676025B1 | 2016-11-15 |
Attorney, Agent or Firm:
IBC (JP)
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