Title:
POLISHING COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2024/029457
Kind Code:
A1
Abstract:
Provided is a polishing composition containing a water-soluble polymer, the polishing composition being capable of achieving a high-quality surface without compromising polishing rate. The polishing composition comprises: silica particles (A) as abrasive particles; a basic compound (B); a modified polyvinyl alcohol-based polymer (C1) as a water-soluble polymer (C); and a chelating agent (D). The modified polyvinyl alcohol-based polymer (C1) exhibits an etching rate of 20 nm/hour or less as determined on the basis of a predetermined etching rate measurement.
Inventors:
KOMOTO YUKARI (JP)
ICHITSUBO TAIKI (JP)
ICHITSUBO TAIKI (JP)
Application Number:
PCT/JP2023/027729
Publication Date:
February 08, 2024
Filing Date:
July 28, 2023
Export Citation:
Assignee:
FUJIMI INC (JP)
International Classes:
B24B37/00; H01L21/304; C09G1/02; C09K3/14
Domestic Patent References:
| WO2022070801A1 | 2022-04-07 | |||
| WO2018216733A1 | 2018-11-29 | |||
| WO2018043504A1 | 2018-03-08 | |||
| WO2017069202A1 | 2017-04-27 |
Foreign References:
| JP2020027834A | 2020-02-20 | |||
| JP2019179837A | 2019-10-17 |
Attorney, Agent or Firm:
ABE, Makoto (JP)
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