POLISHING DEVICE AND POLISHING METHOD

Title:

POLISHING DEVICE AND POLISHING METHOD

Document Type and Number:

WIPO Patent Application WO/2017/122580

Kind Code:

A1

Abstract:

To provide a polishing device capable of performing polishing by selecting a suitable polishing recipe on the basis of a state prior to the polishing, even in a situation where bevel portions have various shapes. A polishing device 100 has: a holding/polishing unit 102 which holds and polishes a substrate W1; and a recognition unit 104 that recognizes data 104a relating to the state of an outer peripheral portion of the substrate W1 prior to performing the polishing. The holding/polishing unit 102 has: a holding unit 106 which holds and rotates the substrate W1; and a polishing unit 108 which polishes the outer peripheral portion of the substrate W1 by pressing a polishing member to the outer peripheral portion. A polishing condition determining unit 110 determines polishing conditions on the basis of the data 104a indicating which type the shape of the outer peripheral portion is among a plurality of types relating to the shape.

More Like This:

WO/2012/011346	INSTRUMENT FOR MEASURING HEIGHT OF PROTRUDING DEFECT ON COLOR FILTER, AND REPAIR DEVICE
JPS59124042	[Title of the device] Wide belt Sander
JP6929206	Polishing equipment

Inventors:

NAKANISHI MASAYUKI (JP)
WATANABE TOSHIFUMI (JP)
KODERA KENJI (JP)

Application Number:

PCT/JP2017/000195

Publication Date:

July 20, 2017

Filing Date:

January 06, 2017

Export Citation:

Click for automatic bibliography generation Help

Assignee:

EBARA CORP (JP)

International Classes:

B24B21/00; B24B9/00; B24B49/12; H01L21/304

Foreign References:

JP2008537316A	2008-09-11
JP2004200527A	2004-07-15
JP2014117782A	2014-06-30
GB2337111A	1999-11-10
JP2009111079A	2009-05-21
JP2008042213A	2008-02-21
JP2011161625A	2011-08-25

Other References: