Title:
POLISHING DEVICE
Document Type and Number:
WIPO Patent Application WO/2009/022539
Kind Code:
A1
Abstract:
A polishing device for polishing the circumferential portion (bevel portion,
notch portion, edge cut portion) of a substrate (W) by sliding a polishing tool
(41) on the circumferential portion.The polishing device comprises a substrate-holding
portion (20) for holding the substrate (W), and a polishing head (42) for polishing
the circumferential portion of the substrate (W) held by the substrate-holding
portion (20) by using the polishing tool (41). The polishing head (42) has a press
pad (50) for pressing the polishing tool (41) against the circumferential portion
of the substrate (W), and a linear motor (90) for moving the press pad (50) reciprocally.
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Inventors:
KIMURA NORIO (JP)
ITO KENYA (JP)
TAKAHASHI TAMAMI (JP)
SEKI MASAYA (JP)
ITO KENYA (JP)
TAKAHASHI TAMAMI (JP)
SEKI MASAYA (JP)
Application Number:
PCT/JP2008/063611
Publication Date:
February 19, 2009
Filing Date:
July 23, 2008
Export Citation:
Assignee:
EBARA CORP (JP)
KIMURA NORIO (JP)
ITO KENYA (JP)
TAKAHASHI TAMAMI (JP)
SEKI MASAYA (JP)
KIMURA NORIO (JP)
ITO KENYA (JP)
TAKAHASHI TAMAMI (JP)
SEKI MASAYA (JP)
International Classes:
B24B21/18; B24B9/00; B24B21/00
Foreign References:
| JP2005193326A | 2005-07-21 | |||
| JP2001300827A | 2001-10-30 | |||
| JP2003234314A | 2003-08-22 | |||
| JPH08174399A | 1996-07-09 | |||
| JP2002093755A | 2002-03-29 |
Other References:
See also references of EP 2199018A4
Attorney, Agent or Firm:
WATANABE, Isamu et al. (5-8 Nishi-Shinjuku 7-chome,Shinjuku-k, Tokyo 23, JP)
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