Title:
POLISHING DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/185656
Kind Code:
A1
Abstract:
The present invention addresses the problem of obtaining a polishing device that can uniformly polish the surface of an object to be processed such as a wire rope, and with which work for mounting/dismounting on/from the object to be processed can be performed easily. The polishing device (100) is provided with an annular polishing member (110) for polishing an object (wire rope) Rw to be processed, a housing (10) that rotatably holds the polishing member (110), and a drive part (20) that applies rotational driving force on the polishing member (110) such that the to-be-processed object Rw inserted in the polishing member (110) is polished by the rotation of the polishing member (110), wherein the polishing member (110) and the housing (10) are both configured to be dividable.
Inventors:
SUGANO WATARU (JP)
Application Number:
PCT/JP2016/001901
Publication Date:
November 24, 2016
Filing Date:
April 04, 2016
Export Citation:
Assignee:
SAKATA MFG CO LTD (JP)
International Classes:
B24B29/08; B24B27/00; B24B29/00; H02G1/02
Foreign References:
| JPS5855840U | 1983-04-15 | |||
| JPH09168960A | 1997-06-30 | |||
| JP2013018060A | 2013-01-31 | |||
| DE1296549B | 1969-05-29 |
Attorney, Agent or Firm:
YAMAMOTO, Shusaku et al. (JP)
山本 秀策 (JP)
山本 秀策 (JP)
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