POLISHING FILM - BANDO CHEMICAL IND

Title:

POLISHING FILM

Document Type and Number:

WIPO Patent Application WO/2016/027671

Kind Code:

A1

Abstract:

The purpose of the present invention is to provide a polishing film which has high grinding power and is not susceptible to causing a defect in an end face of an optical fiber connector due to change in the loading conditions during polishing. The present invention is a polishing film which comprises a base film and a polishing layer that is laminated on the front surface of the base film. This polishing film is characterized in that: the polishing layer contains polishing particles and a binder therefor; and the amount of wear of the polishing layer in a Taber abrasion test is from 10 mg to 25 mg (inclusive). The content of the polishing particles in the polishing layer is preferably 85% by mass or more. It is preferable that the polishing particles contain first polishing particles having a primary particle diameter of 10 nm or more but less than 50 nm and second polishing particles having a primary particle diameter of 50 nm or more but less than 250 nm. The average thickness of the polishing layer is preferably from 4 μm to 15 μm (inclusive). It is preferable that the polishing particles are silica particles.

Inventors:

TAURA TOSHIKAZU (JP)
SAITO KAZUO (JP)

Application Number:

PCT/JP2015/072198

Publication Date:

February 25, 2016

Filing Date:

August 05, 2015

Export Citation:

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Assignee:

BANDO CHEMICAL IND (JP)

International Classes:

B24D11/00; B24D3/00

Domestic Patent References:

WO2002092286A1

2002-11-21

Foreign References:

JP2002239921A	2002-08-28
JP2000506558A	2000-05-30
JP2002103238A	2002-04-09
JPH06262532A	1994-09-20

Other References: