Title:
POLISHING FLUID FOR METAL AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2013/115172
Kind Code:
A1
Abstract:
The present invention relates to a polishing fluid for metal for polishing at least part of a metal portion of a substrate. The polishing fluid for metal comprises an A constituent that is a metal solubilizer including an amino acid, a B constituent that is a compound with a benzotriazole framework, and a C constituent that is an acrylic acid polymer with a weight-average molecular weight of at least 10,000, and the mass ratio of the B constituent to the C constituent (B constituent : C constituent) is 1:1 to 1:5. This configuration enables both a high polishing speed and a low etching speed to be achieved at a higher level, and to form embedded patterns with higher reliability.
Inventors:
ICHIGE YASUHIRO (JP)
HAGA KOUJI (JP)
KONDO SEIICHI (JP)
HAGA KOUJI (JP)
KONDO SEIICHI (JP)
Application Number:
PCT/JP2013/051877
Publication Date:
August 08, 2013
Filing Date:
January 29, 2013
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
H01L21/304; B24B37/00; C09K3/14
Foreign References:
| JP2007150264A | 2007-06-14 | |||
| JP2007073548A | 2007-03-22 |
Attorney, Agent or Firm:
MIYOSHI, Hidekazu et al. (JP)
Hidekazu Miyoshi (JP)
Hidekazu Miyoshi (JP)
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Claims:
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