Title:
POLISHING HEAD PRESSURE CONTROL DEVICE AND METHOD FOR CHEMICAL MECHANICAL PLANARIZATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/120635
Kind Code:
A1
Abstract:
A polishing head pressure control device and method for a chemical mechanical planarization device. A first pressure sensor (5) is disposed on an outlet gas path of a control valve (4), and a second pressure sensor (6) is disposed on an inlet gas path of a membrane receiving chamber (7). A controller (3) performs a real-time closed-loop operation according to pressure values fed back by the first pressure sensor (5) and the second pressure sensor (7), adjusts the opening of the control valve (4), and adjusts a gas pressure in the membrane receiving chamber (7). The present invention can provide a quick response and accurately control the pressure of the membrane receiving chamber (7) of the polishing head, avoid a falsely high pressure at an outlet of the control valve (4) in an inflation phase, and ensure high-precision and low-error pressure control, so that the stable control on the pressure of the membrane receiving chamber (7) of the polishing head is achieved.
Inventors:
CAI NINGYUAN (CN)
ZHU MING (CN)
ZHU MING (CN)
Application Number:
PCT/CN2020/106752
Publication Date:
June 24, 2021
Filing Date:
August 04, 2020
Export Citation:
Assignee:
HANGZHOU SIZONE ELECTRONIC TECH INC (CN)
International Classes:
B24B37/005; B24B37/34
Domestic Patent References:
| WO2015178110A1 | 2015-11-26 |
Foreign References:
| CN110883680A | 2020-03-17 | |||
| CN103567852A | 2014-02-12 | |||
| CN104772691A | 2015-07-15 | |||
| CN102133730A | 2011-07-27 | |||
| CN106670899A | 2017-05-17 | |||
| CN203343870U | 2013-12-18 | |||
| CN108481189A | 2018-09-04 | |||
| JP2000288926A | 2000-10-17 |
Attorney, Agent or Firm:
SHANGHAI HISONG INTELLECTUAL PROPERTY LAW FIRM (GENERAL PARTNERSHIP) (CN)
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