Title:
POLISHING HEAD AND SINGLE-SIDED POLISHING METHOD FOR WAFER
Document Type and Number:
WIPO Patent Application WO/2021/240949
Kind Code:
A1
Abstract:
The present invention provides a polishing head configured to hold a wafer, and perform polishing by rotating the wafer within a polishing surface of a polishing pad while applying pressure to the wafer and pressing the wafer against the polishing surface. The polishing head is characterized by comprising a pressure application surface, and a retainer ring at an outer peripheral portion on the pressure application surface side, wherein the retainer ring includes an outside retainer ring and an inside retainer ring located inside the outside retainer ring, a portion of the pressure application surface corresponding to the inside of the inside retainer ring is configured to apply pressure to the wafer, and the outside retainer ring and the inside retainer ring are configured to mutually independently apply a load to the polishing pad. Thus, it is possible to provide a polishing head capable of controlling a load applied in the vicinity of a wafer edge independently of a load applied within a wafer plane, and a single-sided polishing method for a wafer using this polishing head.
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Inventors:
SUZUKI KENTA (JP)
TANAKA YUKI (JP)
UENO JUNICHI (JP)
KANAI YOSUKE (JP)
NAKANISHI YUYA (JP)
TANAKA YUKI (JP)
UENO JUNICHI (JP)
KANAI YOSUKE (JP)
NAKANISHI YUYA (JP)
Application Number:
PCT/JP2021/009765
Publication Date:
December 02, 2021
Filing Date:
March 11, 2021
Export Citation:
Assignee:
SHINETSU HANDOTAI KK (JP)
FUJIKOSHI MACHINERY CORP (JP)
FUJIKOSHI MACHINERY CORP (JP)
International Classes:
B24B37/30; B24B37/32; H01L21/304
Domestic Patent References:
| WO2008050475A1 | 2008-05-02 |
Foreign References:
| JP2017064908A | 2017-04-06 | |||
| JP2008302464A | 2008-12-18 | |||
| US6113468A | 2000-09-05 | |||
| US20130102152A1 | 2013-04-25 | |||
| KR20040056634A | 2004-07-01 | |||
| JP2018111144A | 2018-07-19 | |||
| JP2001338901A | 2001-12-07 | |||
| JP2017157646A | 2017-09-07 | |||
| JP2013166200A | 2013-08-29 | |||
| JP2013094918A | 2013-05-20 |
Attorney, Agent or Firm:
YOSHIMIYA Mikio et al. (JP)
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