Title:
POLISHING HEAD, AND POLISHING TREATMENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/233681
Kind Code:
A1
Abstract:
Provided are a polishing head and a polishing treatment device whereby it is possible to address phenomena such as wrinkles and star marks, further improvement of a substrate surface such as SFQR is possible, and polishing treatment of large numbers of substrates can be performed stably with high quality. A polishing head 100 has a membrane support ring 3, a membrane 4 that covers an opening on a lower end side of the membrane support ring 3 and holes a substrate W via a backing film adhered to a front surface side of the membrane 4, and a retainer ring 6 that includes the membrane support ring 3 therein and is formed in a shape that surrounds the outer periphery of the substrate W. A plurality of radial ribs 4a extending radially from the vicinity of the center of the membrane and an annular rib 4b formed with a small size relative to the size of an elastic body are formed on a back surface side of the membrane 4, and the radial ribs 4a are formed extending radially outward from the annular rib 4b. In a region on the back surface side of the elastic body that is surrounded by adjacent radial ribs 4a, the membrane support ring 3, and the annular rib 4b, there is arranged a rib restriction member 33 that is formed having a shape that adjoins side surfaces of the radial ribs 4a, the internal peripheral surface of the membrane support ring 3, and the external peripheral surface of the annular rib 4b.
Inventors:
KOMURA AKIO (JP)
KUWANO TAKAFUMI (JP)
TOMIZAWA HAJIME (JP)
KUWANO TAKAFUMI (JP)
TOMIZAWA HAJIME (JP)
Application Number:
PCT/JP2022/039473
Publication Date:
December 07, 2023
Filing Date:
October 24, 2022
Export Citation:
Assignee:
MICRO ENG INC (JP)
International Classes:
B24B37/30; B24B37/32; H01L21/304
Foreign References:
| JP2014008570A | 2014-01-20 | |||
| JP2014018933A | 2014-02-03 | |||
| JP2019202361A | 2019-11-28 | |||
| JP2017205853A | 2017-11-24 | |||
| KR20200062421A | 2020-06-04 | |||
| JP2006263903A | 2006-10-05 |
Attorney, Agent or Firm:
ATENDA PATENT FIRM (JP)
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