Title:
POLISHING-LAYER MOLDED BODY, AND POLISHING PAD
Document Type and Number:
WIPO Patent Application WO/2016/084321
Kind Code:
A1
Abstract:
Provided is a polishing-layer molded body: which is non-porous; which contains a thermoplastic polyurethane that is a polymer of monomers including a polymer diol, an organic diisocyanate, a first chain extender containing a diol having 4 or fewer carbon atoms, and a second chain extender containing a diol having 5 or more carbon atoms; and in which the content ratio of nitrogen derived from isocyanate groups in the organic diisocyanate is 6.3-7.4 mass %.
Inventors:
KADOWAKI KIYOFUMI
KATO SHINYA
OKAMOTO CHIHIRO
KATO MITSURU
TAKEGOSHI MINORI
KATO SHINYA
OKAMOTO CHIHIRO
KATO MITSURU
TAKEGOSHI MINORI
Application Number:
PCT/JP2015/005640
Publication Date:
June 02, 2016
Filing Date:
November 12, 2015
Export Citation:
Assignee:
KURARAY CO (JP)
International Classes:
B24B37/24; B24B37/22; H01L21/304
Domestic Patent References:
| WO2013011922A1 | 2013-01-24 |
Foreign References:
| JP2014038916A | 2014-02-27 | |||
| JP2004123975A | 2004-04-22 | |||
| JP2008235508A | 2008-10-02 | |||
| JP2009078332A | 2009-04-16 |
Other References:
See also references of EP 3225357A4
Attorney, Agent or Firm:
KAWASAKI, Shinichi et al. (JP)
Shin-ichi Kawasaki (JP)
Shin-ichi Kawasaki (JP)
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