Title:
POLISHING LIQUID AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2018/116521
Kind Code:
A1
Abstract:
A polishing liquid of the present invention comprises manganese oxide grindstone particles, permanganate ions, and a cellulose-based surfactant or a cationic surfactant, and has a pH of 5 to 11. The cellulose-based surfactant is preferably carboxy methyl cellulose or a derivative thereof. It is also preferable that the cationic surfactant has a quaternary ammonium ion site. It is also preferable that the concentration of the cellulose-based surfactant or cationic surfactant is 0.01 to 1.0 mass% with respect to the total amount of the polishing liquid.
Inventors:
MATSUO KEN (JP)
MATSUYAMA MASAYUKI (JP)
HORIUCHI MIKIMASA (JP)
KUMAGAI AKINORI (JP)
MATSUYAMA MASAYUKI (JP)
HORIUCHI MIKIMASA (JP)
KUMAGAI AKINORI (JP)
Application Number:
PCT/JP2017/029370
Publication Date:
June 28, 2018
Filing Date:
August 15, 2017
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO (JP)
International Classes:
B24B37/00; H01L21/304; C09G1/02; C09K3/14
Domestic Patent References:
| WO2016158328A1 | 2016-10-06 | |||
| WO2013054883A1 | 2013-04-18 |
Foreign References:
| JP2012248569A | 2012-12-13 | |||
| JP2015005702A | 2015-01-08 | |||
| US20160133465A1 | 2016-05-12 | |||
| JP2015229748A | 2015-12-21 |
Other References:
See also references of EP 3561857A4
Attorney, Agent or Firm:
SHOWA INTERNATIONAL PATENT FIRM (JP)
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