Title:
POLISHING MATERIAL SLURRY AND POLISHING METHOD OF SAME
Document Type and Number:
WIPO Patent Application WO/2024/004750
Kind Code:
A1
Abstract:
A polishing material slurry according to the present invention comprises: manganese oxide abrasive grains that contain manganese oxide particles; permanganate ions; and phosphoric acids. A polishing method of a polishing material slurry according to the present invention polishes an object to be polished with use of the polishing material slurry according to the present invention.
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Inventors:
NAKAMURA TAKUMA (JP)
SARUWATARI YASUNOBU (JP)
SARUWATARI YASUNOBU (JP)
Application Number:
PCT/JP2023/022707
Publication Date:
January 04, 2024
Filing Date:
June 20, 2023
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO LTD (JP)
International Classes:
H01L21/304; B24B37/00; C09G1/02; C09K3/14
Domestic Patent References:
| WO2020255921A1 | 2020-12-24 | |||
| WO2013088928A1 | 2013-06-20 | |||
| WO2013054883A1 | 2013-04-18 | |||
| WO2018116521A1 | 2018-06-28 |
Attorney, Agent or Firm:
TAKAHASHI Ryuji et al. (JP)
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