Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
POLISHING PAD AND CHEMICAL MECHANICAL POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2011/052173
Kind Code:
A1
Abstract:
One aspect of the present disclosures is a polishing pad that contains a non-woven fabric formed from a fiber bundle of microfibers having an average cross-sectional area of 0.1-30 μm2, and an elastomer applied within the non-woven fabric. In a vertical section in the direction of thickness, the average number density (D1­­) of fiber bundle cross-sections in the region within a thickness of 20% in the direction of thickness from a first surface is 1000-5000/mm2, and the ratio (D1/D2) between D1 and the average number density (D2) of fiber bundle cross sections in the region within a thickness of 20% in the direction of thickness from a second surface which is on the reverse of the first surface is 1.3-5.

Inventors:
TAKAOKA NOBUO
KATO MITSURU
OKAMOTO CHIHIRO
NAKAYAMA KIMIO
Application Number:
PCT/JP2010/006269
Publication Date:
May 05, 2011
Filing Date:
October 22, 2010
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
KURARAY CO (JP)
TAKAOKA NOBUO
KATO MITSURU
OKAMOTO CHIHIRO
NAKAYAMA KIMIO
International Classes:
B24B37/24; D04H1/4282; D04H1/435; D04H1/46; D06N7/00; H01L21/304
Foreign References:
JP2008207325A2008-09-11
JP2002224945A2002-08-13
JP2009214275A2009-09-24
JP2009083093A2009-04-23
Attorney, Agent or Firm:
ISHII, Kazuo et al. (JP)
Kazuo Ishii (JP)
Download PDF: