Title:
POLISHING PAD, POLISHING DEVICE INCLUDING SAME, AND MANUFACTURING METHOD THEREOF
Document Type and Number:
WIPO Patent Application WO/2022/014978
Kind Code:
A1
Abstract:
Provided are a polishing pad including a protrusion pattern having porosity so as to improve removal rate and reduce manufacturing costs at the same time, a polishing device including same, and a manufacturing method thereof. The polishing pad comprises: a support layer; and a pattern layer which is directly disposed on the support layer and includes a protrusion pattern having multiple pores, wherein the pores contribute to increase of the planar circumferential length of the protrusion pattern, and the circumferential length of a polishing surface formed by the protrusion pattern per unit area, ranges from 1.0 mm/mm2 to 50.0 mm/mm2.
Inventors:
KIM HYOUNG JAE (KR)
KIM DO YEON (KR)
LEE TAE KYUNG (KR)
KIM DO YEON (KR)
LEE TAE KYUNG (KR)
Application Number:
PCT/KR2021/008851
Publication Date:
January 20, 2022
Filing Date:
July 10, 2021
Export Citation:
Assignee:
KOREA INST IND TECH (KR)
International Classes:
B24B37/26; B24B37/22; H01L21/67
Foreign References:
| KR20160054633A | 2016-05-16 | |||
| US20070128991A1 | 2007-06-07 | |||
| JP2008540154A | 2008-11-20 | |||
| KR19990045523A | 1999-06-25 | |||
| EP0656031B1 | 1998-07-01 |
Attorney, Agent or Firm:
KIM, Hyun Jae (KR)
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