Title:
POLISHING PAD, MANUFACTURING METHOD FOR POLISHING PAD, POLISHING DEVICE, AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2022/070743
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a polishing pad which enables providing excellent flatness of a to-be-polished surface of a to-be-polished object even when used for a long period of time for a CMP process. Further, the present invention addresses the problem of providing a manufacturing method for a polishing pad, a polishing device, and a polishing method. The polishing pad according to the present invention has a polyurethane molded article in which microcapsules are dispersed. The microcapsules each have encapsulated therein water and/or a water-soluble liquid compound. A capsule wall of each of the microcapsules includes at least one selected from the group consisting of polyurethane urea, polyurethane, polyurea, polyester, polyamide, and poly(meth)acrylate.
Inventors:
HAYASHI SHINYA (JP)
ARIOKA DAISUKE (JP)
ARIOKA DAISUKE (JP)
Application Number:
PCT/JP2021/032113
Publication Date:
April 07, 2022
Filing Date:
September 01, 2021
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
B01J13/16; B24B37/24; H01L21/304
Foreign References:
| JP2001162515A | 2001-06-19 | |||
| US20180346648A1 | 2018-12-06 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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