Title:
POLISHING PAD, AND METHOD AND APPARATUS FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2005/023487
Kind Code:
A1
Abstract:
A polishing pad having a novel structure is disclosed which enables to stably form a thin, generally uniform film of a slurry on the polishing surface, and thus enables to stably improve accuracy and efficiency in polishing of semiconductor substrates. A polishing surface (14) of a polishing pad (10) is provided with a circular groove (16) extending in the circumferential direction, while a communicating hole (24) is formed so as to penetrate through the polishing pad (10) in the thickness direction. The communicating hole (24) has an opening on the bottom of the circular groove (16).
Inventors:
SUZUKI TATSUTOSHI (JP)
Application Number:
PCT/JP2004/008631
Publication Date:
March 17, 2005
Filing Date:
June 18, 2004
Export Citation:
Assignee:
TOHO ENGINEERING KABUSHIKI KAI (JP)
SUZUKI TATSUTOSHI (JP)
SUZUKI TATSUTOSHI (JP)
International Classes:
B24B37/26; B24D13/14; (IPC1-7): B24B37/00; H01L21/304
Foreign References:
| JP2001071256A | 2001-03-21 | |||
| JP2001179611A | 2001-07-03 | |||
| JP2002160153A | 2002-06-04 | |||
| JPH11277407A | 1999-10-12 | |||
| JP2002011630A | 2002-01-15 |
Attorney, Agent or Firm:
Kasai, Yoshitaka (Sanyoku-Bldg. 345-5, Kohmei-ch, Tsu-shi Mie 06, JP)
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