Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
POLISHING PAD, METHOD FOR PRODUCING POLISHING PAD, AND METHOD FOR POLISHING SURFACE OF OPTICAL MATERIAL OR SEMICONDUCTOR MATERIAL
Document Type and Number:
WIPO Patent Application WO/2022/153961
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide: a polishing pad which uses, as a high-molecular-weight polyol of an isocyanate-terminated urethane prepolymer, a polyol that is different from conventionally used PTMG or the like, said polyol forming a polishing layer; a method for producing this polishing pad; and a method for polishing the surface of an optical material or semiconductor material, said method using this polishing pad.　A polishing pad which has a polishing layer that contains a polyurethane resin, wherein: the polyurethane resin is a cured product of a curable resin composition that contains an isocyanate-terminated urethane prepolymer and a curing agent; the isocyanate-terminated urethane prepolymer is a reaction product of a polyol component and a polyisocyanate component; and the polyol component contains a polyol that has a carbonate group in each molecule.

Inventors:
KAWAMURA YOSHIHIDE (JP)
TATENO TEPPEI (JP)
KURIHARA HIROSHI (JP)
NARUSHIMA SATSUKI (JP)
TAKAMIZAWA YAMATO (JP)
OCHI KEISUKE (JP)
KAWASAKI TETSUAKI (JP)
Application Number:
PCT/JP2022/000475
Publication Date:
July 21, 2022
Filing Date:
January 11, 2022
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
FUJIBO HOLDINGS INC (JP)
International Classes:
B24B37/24; C08G18/10; C08G18/38; C08G18/44; C08G18/48; C08G18/76; C08J5/14; H01L21/304
Foreign References:
JP5661130B22015-01-28
JP2020157415A2020-10-01
JP5970636B22016-08-17
JP2014069273A2014-04-21
JP2004330411A2004-11-25
Attorney, Agent or Firm:
YAMAMOTO, Osamu et al. (JP)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: COMMUNICATION SYSTEM

Next Patent: COMPOUND, HOLE TRANSPORT MATERIAL, AND PHOTOELECTRIC CONVERSION ELEMENT INCLUDING SAME