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Patent Searching and Data


Title:
POLISHING PAD AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/169055
Kind Code:
A1
Abstract:
Provided is a polishing pad with which it is possible, when polishing an object to be polished that has a convex part and/or a concave part on the surface thereof, to adequately polish the portion near the convex part and/or the inner surface of the concave part on the surface of the object to be polished. The polishing pad has an erect fiber part (1) in which a plurality of fibers (12) having a length of 3 mm or more are provided to be erect on the surface of a base part (11), the number of fibers (12) being 10,000/cm2 or higher.

Inventors:
ASAI MAIKO (JP)
ITO YUUICHI (JP)
TAMAI KAZUSEI (JP)
TAHARA MUNEAKI (JP)
Application Number:
PCT/JP2017/003016
Publication Date:
October 05, 2017
Filing Date:
January 27, 2017
Export Citation:
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Assignee:
FUJIMI INC (JP)
International Classes:
B24B37/24; B24B37/22; B24D11/00; H01L21/304
Domestic Patent References:
WO2008093850A12008-08-07
Foreign References:
JPS6392319A1988-04-22
JP2008055575A2008-03-13
JP2015221462A2015-12-10
US7186166B22007-03-06
JPH08153695A1996-06-11
Other References:
See also references of EP 3437798A4
Attorney, Agent or Firm:
MORI Tetsuya et al. (JP)
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