Title:
POLISHING PAD FOR WAFER POLISHING DEVICE, AND APPARATUS AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2021/157781
Kind Code:
A1
Abstract:
The present invention provides a method for manufacturing a polishing pad, the method comprising: a step for manufacturing a non-woven pad; a polyurethane impregnation step for impregnating the non-woven pad with polyurethane; and a surface polishing step for polishing the surface of the non-woven pad impregnated with polyurethane, wherein the polyurethane impregnation step and the surface polishing step are performed such that the density ratio between the surface layer and the inside of the polishing pad is uniform.
Inventors:
AHN JIN WOO (KR)
JANG SOO CHEON (KR)
JANG SOO CHEON (KR)
Application Number:
PCT/KR2020/006076
Publication Date:
August 12, 2021
Filing Date:
May 08, 2020
Export Citation:
Assignee:
SK SILTRON CO LTD (KR)
International Classes:
B24D18/00; B24B37/24
Foreign References:
| JP2015096286A | 2015-05-21 | |||
| JP5061694B2 | 2012-10-31 | |||
| JP2016196053A | 2016-11-24 | |||
| JP2017136662A | 2017-08-10 | |||
| JP2018122427A | 2018-08-09 |
Attorney, Agent or Firm:
LEE, Seung Chan (KR)
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