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Patent Searching and Data


Title:
POLISHING PAD
Document Type and Number:
WIPO Patent Application WO/2013/031692
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a polishing pad capable of preventing slurry leakage while having excellent optical detection precision. This polishing pad is characterized in that a polishing area, a cushion layer, and a support film are layered in the stated order, and an optically transparent region is provided on the support film, in an aperture that passes through the polishing area and cushion layer. The optically transparent area has a peripheral part and a recessed part in the polishing table-side surface. The support film is layered on the peripheral part, but the support film is not layered on the recessed part, which remains open.

Inventors:
KIMURA TSUYOSHI (JP)
Application Number:
PCT/JP2012/071472
Publication Date:
March 07, 2013
Filing Date:
August 24, 2012
Export Citation:
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Assignee:
TOYO TIRE & RUBBER CO (JP)
KIMURA TSUYOSHI (JP)
International Classes:
B24B37/22; B24B37/013; H01L21/304
Foreign References:
JP2004343090A2004-12-02
JP2004327779A2004-11-18
JP2008226911A2008-09-25
JP2009045694A2009-03-05
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
Patent business corporation ユニアス international patent firm (JP)
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