Title:
POLISHING PAD
Document Type and Number:
WIPO Patent Application WO/2014/087771
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a polishing pad that hardly generates scratches on a surface of a subject to be polished. This polishing pad is characterized in that: the polishing pad is provided with a polishing layer having a polishing region and a light transmissive region; the light transmissive region includes a surface layer positioned on the pad surface side, and at least one soft layer laminated under the surface layer; and the soft layer has a hardness lower than that of the surface layer.
Inventors:
NAKAMURA KENJI (JP)
Application Number:
PCT/JP2013/079558
Publication Date:
June 12, 2014
Filing Date:
October 31, 2013
Export Citation:
Assignee:
TOYO TIRE & RUBBER CO (JP)
International Classes:
B24B37/013; B24B37/22; H01L21/304
Foreign References:
| JP2007044814A | 2007-02-22 | |||
| JP2012508982A | 2012-04-12 | |||
| JP2003285259A | 2003-10-07 | |||
| JP2007276009A | 2007-10-25 |
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
Patent business corporation ユニアス international patent firm (JP)
Patent business corporation ユニアス international patent firm (JP)
Download PDF: