Title:
POLISHING PAD
Document Type and Number:
WIPO Patent Application WO/2014/119390
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a polishing pad which comprises a polishing layer having a triple phase separation structure and has a high polishing rate and excellent planarization characteristics, while being capable of suppressing the occurrence of scratches.
A polishing pad of the present invention comprises a polishing layer, and the polishing layer is formed of a reaction cured body of a polyurethane starting material composition that contains: an isocyanate-terminated prepolymer (A) which is obtained by reacting a prepolymer starting material composition (a) that contains an isocyanate component and a polyester polyol; an isocyanate-terminated prepolymer (B) which is obtained by reacting a prepolymer starting material composition (b) that contains an isocyanate component and a polyether polyol; and a chain extender. The polyether polyol contains a polyether polyol (C) that has a number average molecular weight of 1,000 or less and a polyether polyol (D) that has a number average molecular weight of 1,900 or more. The reaction cured body has a triple phase separation structure.
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Inventors:
SHIMIZU SHINJI (JP)
Application Number:
PCT/JP2014/050820
Publication Date:
August 07, 2014
Filing Date:
January 17, 2014
Export Citation:
Assignee:
TOYO TIRE & RUBBER CO (JP)
International Classes:
B24B37/24; C08G18/10; C08J5/14; H01L21/304
Foreign References:
| JP2010082719A | 2010-04-15 | |||
| JP2000263423A | 2000-09-26 | |||
| JP2007204651A | 2007-08-16 | |||
| JP2012000745A | 2012-01-05 |
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
Patent business corporation ユニアス international patent firm (JP)
Patent business corporation ユニアス international patent firm (JP)
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