Title:
POLISHING PAD
Document Type and Number:
WIPO Patent Application WO/2016/051796
Kind Code:
A1
Abstract:
The present invention provides a polishing pad capable of uniformly polishing the whole wafer. The present invention relates to a polishing pad that is characterized in that: the polishing pad is provided with at least (A) a surface polishing layer, (B) an adhesive layer, and (C) a cushion layer; the layers are laminated in the order of (A)/(B)/(C); the compression rate of (A) the surface polishing layer is 0.3-3.0 %; and the relationship wherein the compression rate of (C) the cushion layer is higher than the compression rate of (A) the surface polishing layer is satisfied.
Inventors:
TACHIBANA TOSHIMITSU (JP)
FUKUSHIMA TAMAO (JP)
FUKUSHIMA TAMAO (JP)
Application Number:
PCT/JP2015/004980
Publication Date:
April 07, 2016
Filing Date:
September 30, 2015
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
B24B37/22; H01L21/304
Foreign References:
| JP2003218074A | 2003-07-31 | |||
| JP2002270550A | 2002-09-20 | |||
| JP2001176829A | 2001-06-29 | |||
| JP2013018056A | 2013-01-31 | |||
| JP2014124718A | 2014-07-07 | |||
| JP2014172168A | 2014-09-22 | |||
| JP2011067946A | 2011-04-07 | |||
| JP2011183495A | 2011-09-22 | |||
| JP2008254171A | 2008-10-23 |
Attorney, Agent or Firm:
KAMADA, KOICHI (JP)
Koichi Kamata (JP)
Koichi Kamata (JP)
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