Title:
POLISHING SHEET AND POLISHING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/135180
Kind Code:
A3
Abstract:
Object: To provide a polishing sheet capable of efficiently polishing a hard material such as a metal product so as to form a smooth surface with minimal unevenness. Solution: A polishing sheet (10) including: a substrate (11); a plurality of three-dimensional elements (12) containing abrasive grains and a binding material; and an intermediate layer (13) provided between the three-dimensional elements (12) and the substrate (11) so as to join the substrate (11) and the three-dimensional elements (12), wherein a Young's modulus of the substrate (11) at 25°C is not less than 3.0 x 109Pa; and a Young's modulus of the intermediate layer (13) at 25°C is not less than 1.0 x 107Pa and not greater than 5.0 x 108Pa.
More Like This:
WO/2023/130051 | ABRASIVE ARTICLES AND METHODS OF FORMING SAME |
WO/2019/029919 | FLEXIBLE GRINDING MEANS |
Inventors:
NAKAMURA YOKO (JP)
TASAKA YOSHIHIKO (JP)
NAGAFUCHI NAOHIRO (JP)
TASAKA YOSHIHIKO (JP)
NAGAFUCHI NAOHIRO (JP)
Application Number:
PCT/IB2019/050029
Publication Date:
August 22, 2019
Filing Date:
January 02, 2019
Export Citation:
Assignee:
3M INNOVATIVE PROPERTIES CO (US)
International Classes:
B24D11/02; B24D3/00
Domestic Patent References:
WO2001004227A2 | 2001-01-18 | |||
WO1999059778A1 | 1999-11-25 |
Foreign References:
US20050152652A1 | 2005-07-14 | |||
US20080102720A1 | 2008-05-01 | |||
JP2017170534A | 2017-09-28 |
Attorney, Agent or Firm:
MEDVED, Aleksander et al. (US)
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