Title:
POLISHING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2021/220787
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a polishing system in which the amount that an object to be polished is polished can be simply and precisely measured. The polishing system of the present invention uses an abrasive slurry to polish an object to be polished and is characterized by comprising a polishing amount calculation step unit that measures the amount of free metal ions of a metallic element, from group 1 or group 2 of the periodic table, derived from the object to be polished in the used slurry, and calculates, from the amount of the free metal ions, the amount that the object to be polished has been polished.
Inventors:
TAKAHASHI ATSUSHI (JP)
MAEZAWA AKIHIRO (JP)
TSUKIGATA FUMIKO (JP)
MIZOGUCHI KEISUKE (JP)
MAEZAWA AKIHIRO (JP)
TSUKIGATA FUMIKO (JP)
MIZOGUCHI KEISUKE (JP)
Application Number:
PCT/JP2021/015173
Publication Date:
November 04, 2021
Filing Date:
April 12, 2021
Export Citation:
Assignee:
KONICA MINOLTA INC (JP)
International Classes:
B24B37/005; B23Q17/00; B23Q17/09; B24B37/013; B24B49/08; H01L21/304
Domestic Patent References:
| WO2013146132A1 | 2013-10-03 |
Foreign References:
| JPH11145091A | 1999-05-28 | |||
| JP2019107755A | 2019-07-04 | |||
| JP2001079759A | 2001-03-27 | |||
| JP2007520083A | 2007-07-19 | |||
| JP2000135673A | 2000-05-16 |
Attorney, Agent or Firm:
KOYO INTERNATIONAL PATENT FIRM (JP)
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