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Patent Searching and Data


Title:
POLYACETAL RESIN COMPOSITION AND MOLDED ARTICLE THEREOF
Document Type and Number:
WIPO Patent Application WO/2015/147271
Kind Code:
A1
Abstract:
 The purpose of the present invention is to provide a resin composition that makes it possible to highly productively produce a molded article having high durability, slidability, and wear resistance. The present invention provides a polyacetal resin composition containing (A) 100 parts by mass of polyacetal resin and (B) 10-100 parts by mass of glass filler, wherein, when a molded article obtained by molding this polyacetal resin composition is subjected to tensile fracture, the surface of the (B) glass filler projecting from the fracture surface of the fractured molded article is covered by a component containing (A) polyacetal resin having an average thickness of 0.2-3.0 μm.

Inventors:
TAKAHASHI YOSUKE (JP)
MIYOSHI TAKAAKI (JP)
Application Number:
PCT/JP2015/059657
Publication Date:
October 01, 2015
Filing Date:
March 27, 2015
Export Citation:
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Assignee:
ASAHI KASEI CHEMICALS CORP (JP)
International Classes:
C08L59/02; C08K3/40
Domestic Patent References:
WO2013053914A12013-04-18
Foreign References:
JP2006037267A2006-02-09
JP2008044995A2008-02-28
JP2013539810A2013-10-28
JP2004359791A2004-12-24
Other References:
See also references of EP 3124543A4
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
Yoshiyuki Inaba (JP)
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