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Title:
POLYACETAL RESIN COMPOSITION AND MOLDINGS
Document Type and Number:
WIPO Patent Application WO/1998/029510
Kind Code:
A1
Abstract:
A polyacetal resin composition prepared by adding about 0.01 to 10 parts by weight of a glyoxydiureide compound to 100 parts by weight of a polyacetal resin. The glyoxydiureide compounds usable herein include glyoxydiureide itself and derivatives thereof (such as metal salts thereof). About 0.01 to 10 parts by weight of a basic nitrogen compound may be further added thereto. The nitrogen compounds usable herein include melamine, melamine resins, and polyamide resins. In addition, an antioxidant may be added to the composition. The compositions serve to improve the stability, particularly the thermal stability, of the polyacetal resin, and prevents the evolution of formaldehyde.

Inventors:
HARASHINA HATSUHIKO (JP)
KURITA HAYATO (JP)
YAMADA TATSUYA (JP)
Application Number:
PCT/JP1997/004758
Publication Date:
July 09, 1998
Filing Date:
December 22, 1997
Export Citation:
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Assignee:
POLYPLASTICS CO (JP)
HARASHINA HATSUHIKO (JP)
KURITA HAYATO (JP)
YAMADA TATSUYA (JP)
International Classes:
C08K5/3445; (IPC1-7): C08L59/00; C08K5/3445
Foreign References:
JPH0841288A1996-02-13
JPS57118569A1982-07-23
JPS52102412A1977-08-27
JPS5231072A1977-03-09
JPS5225772A1977-02-25
JPS5225771A1977-02-25
JPS5136453A1976-03-27
JPS5119771A1976-02-17
Other References:
See also references of EP 0955337A4
Attorney, Agent or Firm:
Kuwata, Mitsuo (10th floor 3-19, Nishitemma 6-chome, Kita-k, Osaka-shi Osaka 530, JP)
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