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Title:
POLYACETAL RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2008/038745
Kind Code:
A1
Abstract:
Disclosed is a polyacetal resin composition which has excellent weather resistance and suppressed surface gloss, while being remarkably reduced in generation of formaldehydes. Specifically disclosed is a polyacetal resin composition which is obtained by blending 100 parts by weight of a polyacetal resin (A) with 0.01-5 parts by weight of a weather (light) stabilizer (B), 1-50 parts by weight of a core-shell polymer (C) having a core of a rubbery polymer and a shell of a glassy polymer composed of a vinyl copolymer, and 0.01-5 parts by weight of a compound (D) selected from the group consisting of isocyanate compounds, isothiocyanate compounds and modified forms of them.

Inventors:
KATSUCHI HIROKAZU (JP)
HASE HIROYUKI (JP)
Application Number:
PCT/JP2007/068904
Publication Date:
April 03, 2008
Filing Date:
September 20, 2007
Export Citation:
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Assignee:
POLYPLASTICS CO (JP)
KATSUCHI HIROKAZU (JP)
HASE HIROYUKI (JP)
International Classes:
C08L59/00; C08K5/00; C08L51/04
Domestic Patent References:
WO2004058875A12004-07-15
WO2004058875A12004-07-15
Foreign References:
JPH07165935A1995-06-27
JPH07195496A1995-08-01
JPH07195476A1995-08-01
JPH05179104A1993-07-20
JPH05179103A1993-07-20
JPH05179104A1993-07-20
JPH05125255A1993-05-21
JPH10182928A1998-07-07
JPH10298201A1998-11-10
JP2005162909A2005-06-23
JP2005163019A2005-06-23
Other References:
See also references of EP 2067821A4
Attorney, Agent or Firm:
FURUYA, Satoshi et al. (2-17-8 Nihonbashi-Hamach, Chuo-ku Tokyo 07, JP)
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