Title:
POLY(AMIC ACID) COMPOSITION, POLYIMIDE COMPOSITION, ADHESIVE, AND LAYERED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2022/210321
Kind Code:
A1
Abstract:
This poly(amic acid) composition contains a poly(amic acid). Aromatic monomers account for 95 mol% or more of all monomers that constitute the poly(amic acid). The aromatic monomers include 40-95 mol% of a monomer (A) having a prescribed diphenyl ether skeleton, 0-60 mol% of a monomer (B) having a benzophenone skeleton and 0-60 mol% of a monomer (C) having a biphenyl skeleton, each relative to the total amount of monomers. The monomer (A) having a diphenyl ether skeleton includes 20 mol% or more of a monomer (A-1) having at least three aromatic rings relative to the total amount of monomers. The diamine/tetracarboxylic acid dianhydride molar ratio is 0.90-0.999.
Inventors:
OKAZAKI MASAKI
TAKASE KO
URAKAMI TATSUHIRO
SAKATA YOSHIHIRO
TAKASE KO
URAKAMI TATSUHIRO
SAKATA YOSHIHIRO
Application Number:
PCT/JP2022/014235
Publication Date:
October 06, 2022
Filing Date:
March 25, 2022
Export Citation:
Assignee:
MITSUI CHEMICALS INC (JP)
International Classes:
C08G73/10; C08L79/08
Domestic Patent References:
WO2013183293A1 | 2013-12-12 |
Foreign References:
JP2001198523A | 2001-07-24 | |||
JPH08231714A | 1996-09-10 | |||
JP2020072198A | 2020-05-07 | |||
JP2016125054A | 2016-07-11 | |||
JP2020055147A | 2020-04-09 | |||
JP2002216542A | 2002-08-02 | |||
JP2020007397A | 2020-01-16 | |||
JP2009086147A | 2009-04-23 |
Attorney, Agent or Firm:
WASHIDA & ASSOCIATES (JP)
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