Title:
POLYAMIC ACID COMPOSITION AND POLYIMIDE COMPOSITION, POLYIMIDE FILM, AND DISPLAY PANEL SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2023/013401
Kind Code:
A1
Abstract:
A polyamic acid composition according to the present disclosure contains a polyamic acid. A tetracarboxylic acid dianhydride constituting the polyamic acid contains a compound represented by formula (a1) and a compound represented by formula (a2) and/or a compound represented by formula (a3), and a diamine constituting the polyamic acid contains a compound represented by formula (b1). The content of the compound represented by formula (a1) is 10 mol% or more relative to the total amount of acid dianhydrides, and the combined amount of the compounds represented by formulas (a1) and (a2) is 30-80 mol% relative to the total amount of the acid dianhydrides. [Compound 1] [Compound 2] [Compound 3] [Compound 4]
Inventors:
FUKUKAWA KENICHI
HISAMUNE YUTAKA
URAKAMI TATSUHIRO
SAKATA YOSHIHIRO
HISAMUNE YUTAKA
URAKAMI TATSUHIRO
SAKATA YOSHIHIRO
Application Number:
PCT/JP2022/028046
Publication Date:
February 09, 2023
Filing Date:
July 19, 2022
Export Citation:
Assignee:
MITSUI CHEMICALS INC (JP)
International Classes:
C08G73/10; C08J5/18
Domestic Patent References:
| WO2014129464A1 | 2014-08-28 | |||
| WO2014097633A1 | 2014-06-26 |
Foreign References:
| JP2016204457A | 2016-12-08 | |||
| JPH05216039A | 1993-08-27 | |||
| CN101591521A | 2009-12-02 |
Attorney, Agent or Firm:
WASHIDA & ASSOCIATES (JP)
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