POLYAMIC ACID COMPOSITION AND POLYIMIDE FILM PREPARED WITH THE SAME

WIPO Patent Application WO/2023/101329

A1

The present disclosure relates to a polyamic acid composition comprising: a polyamic acid comprising, as a polymerization unit, at least one selected from a dianhydride monomer represented by Chemical Formula 1 and a diamine monomer represented by Chemical Formula 2 or Chemical Formula 3; an imidazole-based compound; an epoxy-based compound; and an organic solvent, and a polyimide comprising the same. The polyamic acid composition of the present disclosure and the polyimide comprising the same have excellent mechanical properties such as strength and elongation while maintaining a low yellow index and excellent thermal properties.

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PARK SE JOO (KR)
PARK JOON CHUL (KR)
LEE IK SANG (KR)

PCT/KR2022/018802

June 08, 2023

November 25, 2022

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PI ADVANCED MAT CO LTD (KR)

C08G73/10; C08J5/18; G09F9/30

CN113201219A	2021-08-03
KR101749626B1	2017-06-21
JP2020019839A	2020-02-06
US20190062503A1	2019-02-28
JP2018168371A	2018-11-01

KIM, Kyeongkyo et al. (KR)

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