POLYAMIC ACID COMPOSITION, POLYIMIDE PRODUCTION METHOD, LAMINATE PRODUCTION METHOD, AND ELECTRONIC DEVICE PRODUCTION METHOD

WIPO Patent Application WO/2023/248810

A1

This polyamic acid composition contains a polyamic acid and an organic solvent. The polyamic acid has a residue including a divalent organic group represented by chemical formula (1), a 3,3',4,4'-biphenyl tetracarboxylic dianhydride residue, and a p-phenylene diamine residue. The organic solvent contains at least one compound selected from the group consisting of compounds represented by general formula (2) and compounds represented by general formula (3). In general formula (2), R1, R2, and R3 each independently represent a hydrogen atom or a monovalent organic group having one or more carbon atoms, and at least one of R1, R2, and R3 represents a monovalent organic group having two or more carbon atoms. In general formula (3), R4 represents a monovalent organic group having two or more carbon atoms.　

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NAKAYAMA HIROFUMI (JP)
KATO MOEKO (JP)
TAKI RYUNOSUKE (JP)
TANAKA NOBUAKI (JP)
SHIRAI YUKI (JP)
HORII ETSUO (JP)

PCT/JP2023/021312

December 28, 2023

June 08, 2023

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KANEKA CORP (JP)

C08L79/08; C08G73/10; H05K1/03

WO2015147046A1	2015-10-01
WO2016111182A1	2016-07-14

JP2022061487A	2022-04-18
JP2019214540A	2019-12-19
JP2019183066A	2019-10-24
JP2007137933A	2007-06-07
JP2016213141A	2016-12-15

HARUKA PATENT & TRADEMARK ATTORNEYS (JP)

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