POLYAMIC ACID COMPOSITION WITH IMPROVED ADHESIVE STRENGTH AND POLYIMIDE FILM COMPRISING SAME

Title:

POLYAMIC ACID COMPOSITION WITH IMPROVED ADHESIVE STRENGTH AND POLYIMIDE FILM COMPRISING SAME

Document Type and Number:

WIPO Patent Application WO/2017/111299

Kind Code:

A1

Abstract:

The present invention provides: a polyamic acid composition comprising a compound having a particular chemical structure as a diamine component; and a polyimide prepared from the composition. The polyamic acid composition according to the present invention provides excellent optical characteristics, high adhesive strength characteristics with a glass substrate, and high thermal characteristics, and therefore the polyimide film using the same can be applied as a material for a flexible display.

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Inventors:

OH HYUN SEOK (KR)
KIM DONG YOUN (KR)
KIM SUN YOUNG (KR)
AHN KYUNG IL (KR)

Application Number:

PCT/KR2016/012828

Publication Date:

June 29, 2017

Filing Date:

November 09, 2016

Export Citation:

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Assignee:

DOOSAN CORP (KR)

International Classes:

C08G73/10; C08J5/18; C08L79/08; G09F9/30

Domestic Patent References:

WO2015152178A1	2015-10-08
WO2016121691A1	2016-08-04

Foreign References:

JP2003073345A	2003-03-12
KR20140144528A	2014-12-19
JP2003294967A	2003-10-15

Attorney, Agent or Firm:

HANBEOT PATENT & LAW FIRM (KR)

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